The present invention relates to thermosetting reactive resin mixtures comprising polyepoxides, polyisocyanates, a cyanoacetamide compound as a reaction accelerator and, if appropriate, fillers and/or conventional additives, and to the use of cyanoacetyl compounds as a hardener for such reactive mixtures.

German Offenlegungsschrift 3,323,084 has disclosed the use of tertiary amines and imidazoles as well as onium salts of tertiary amines and imidazoles,addition complexes of boron trihalides with tertiary amines and imidazoles, or tertiary amines and imidazoles deactivated by electron acceptors as reaction accelerators for reactive resin mixtures of polyepoxides and polyisocyanates (EP/IC resins) in an EP:IC molar mixing ratio from 1 to 5.

As hardeners for such EP/IC resins, the BF.sub.3 complexes and BCl.sub.3 complexes of n-octyldimethylamine and of benzyldimethylamine and also 7,7,8,8-tetra-cyanoquinodimethane-1-cyanoethyl-2-phenyl-imidazole are specifically listed in EP-A 130,454 as representatives of a deactivated imidazole accelerator.

Moreover, amines, especially tertiary amines and imidazoles, are described in German Offenlegungsschrift 3,323,153 as particularly suitable reaction accelerators for special EP/IC resins which, for an improvement in the thermal/mechanical properties of the resins, contain polyoxyalkylene glycol polyglycidyl ethers as an additional epoxide resin component.

In addition, cyanoacetates and cyanoacetamides are known from German Offenlegungsschrift 2,846,123 as hardeners for epoxide resins under the action of heat.

It is, however, a disadvantage that the reactive resin systems, which contain boron halide/amine complexes as reaction accelerators, have poor moisture resistance. For example, for a combination of 3-4% of BF.sub.3 /monoethylamine with an epoxide resin, this leads to a very pronounced rise in the dielectric loss factor at 96% relative humidity at 70.degree. C. In addition, highly corrosive gases such as HCl and HF can be formed by hydrolysis of the corresponding boron halides, which is a disadvantage for use in the field of electrical engineering and electronics.

In addition, there is a demand for EP/IC resin systems with reaction accelerators which, at the processing temperature, show a slowly proceeding reaction, i.e. allow a longer processing time and also show better storage stability. Good heat-aging resistance is also important for the use of such EP/IC resin systems in the field of electrical engineering and electronics.

Surprisingly, cyanoacetamide accelerators in fact have the desired properties, outlined above, in reactive EP/IC resin systems.

The present invention relates to thermosetting reactive systems comprising

(a) at least one epoxide resin,

(b) at least one isocyanate resin,

(c) a reaction accelerator of the formula I ##STR3## in which R.sup.1 is --(CR.sup.4 R.sup.5).sub.n -- with n=2-24, phenylene or naphthylene which are unsubstituted or mono- or poly-substituted by halogen, nitro, C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 alkoxy or C.sub.3 -C.sub.8 dialkylaminoalkyl, or a radical of the formulae ##STR4## R.sup.2 and R.sup.3 independently of one another are C.sub.1 -C.sub.12 alkyl, phenyl or naphthyl which are unsubstituted or mono- or poly-substituted by halogen, nitro, C.sub.1 -C.sub.4 alkyl or C.sub.1 -C.sub.4 alkoxy, or also C.sub.7 -C.sub.13 aralkyl, or in which R.sup.2 and R.sup.3, together with the N atom to which they are linked, form a 5-membered, 6-membered or 7-membered heterocyclic ring, and R.sup.4 and R.sup.5 independently of one another are hydrogen or C.sub.1 -C.sub.8 alkyl, and

(d) if appropriate, a filler and/or further additives conventional in industry.

Preferably, the reactive systems according to the invention contain, as the epoxide resins a) polyepoxide compounds, especially those containing aliphatic, cycloaliphatic or aromatic epoxides or mixtures thereof.

Suitable epoxides resins (a) are all types of epoxide resins, for example those which contain groups, bonded directly to oxygen, nitrogen or sulfur atoms, of the formula II ##STR5## in which either R.sup.6 and R.sup.8 are each a hydrogen atom, in which case R.sup.7 is then a hydrogen atom or a methyl group, or R.sup.6 and R.sup.8 together are -CH.sub.2 CH.sub.2 - or -CH.sub.2 CH.sub.2 CH.sub.2 -, in which case R.sup.7 is then a hydrogen atom.

Examples of such resins are polyglycidyl esters and poly(.beta.-methylglycidyl) esters which an be obtained by reacting a compound, containing two or more carboxyl groups per molecule, with epichlorohydrin, glycerol dichlorohydrin or .beta.-methylepichlorohydrin in the presence of alkali. Such polyglycidyl esters can be derived from aliphatic polycarboxylic acids, for example oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid or dimerized or trimerized linoleic acid, from cycloaliphatic polycarboxylic acids such as tetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, hexahydrophthalic acid and 4-methylhexahydrophthalic acid, and from aromatic polycarboxylic acids such as phthalic acid, isophthalic acid and terephthalic acid.

Further examples are polyglycidyl and poly-(.beta.-methylglycidyl)-ethers which can be obtained by reacting a compound, containing at least two free alcoholic and/or phenolic hydroxyl groups per molecule, with the corresponding epichlorohydrin under alkaline conditions, or also in the presence of an acid catalyst with subsequent alkali treatment. These ethers can be prepared with poly-(epichlorohydrin) from acyclic alcohols, such as ethylene glycol, diethylene glycol and higher poly-(oxyethylene) glycols, propane-1,2-diol and poly-(oxypropylene) glycols, propane-1,3-diol, butane-1,4-diol, poly-(oxytetramethylene) glycols, pentane-1,5-diol, hexane-1,6-diol, hexane-2,4,6-triol, glycerol, 1,1,1-trimethylolpropane, pentaerythritol and sorbitol, from cycloaliphatic alcohols such as resorcinol, quinitol, bis-(4-hydroxycyclohexyl)-methane, 2,2-bis-(4-hydroxycyclohexyl)-propane and 1,1-bis-(hydroxymethyl)-cyclohex-3-ene, and from alcohols with aromatic nuclei, such as N,N-bis-(2-hydroxyethyl)-aniline and p,p'-bis-(2-hydroxyethylamino)-diphenylmethane. They can also be prepared from mononuclear phenols such as resorcinol and hydroquinone and polynuclear phenols such as bis-(4-hydroxyphenyl)-methane, 4,4-dihydroxybiphenyl, bis-(4-hydroxyphenyl) sulfone, 1,1,2,2-tetrakis-(4-hydroxyphenyl)-ethane, 2,2-bis-(4-hydroxyphenyl)-propane (otherwise known as bisphenol A) and 2,2-bis-(3,5-dibromo-4-hydroxyphenyl)-propane, and from novolaks formed from aldehydes, such as formaldehyde, acetaldehyde, chloral and furfural, with phenols such as phenol itself and a phenol ring-substituted by chlorine atoms or alkyl groups each having up to nine carbon atoms, such as 4-chlorophenol, 2 -methylphenol and 4-tertbutylphenol.

Poly-(N-glycidyl) compounds comprise, for example, those which are obtained by dehydrochlorination of the reaction products of epichlorohydrin with amines containing at least two amino hydrogen atoms, such as aniline, n-butylamine, bis-(4-aminophenyl)-methane and bis-(4-methylaminophenyl)-methane, triglycidyl isocyanurate and also N,N'-diglycidyl derivatives of cyclic alkyleneureas such as ethyleneurea and 1,3-propyleneurea, and hydantoins such as 5,5-dimethylhydantoin.

Examples of poly-(S-glycidyl) compounds are the di-S-glycidyl derivatives of dithiols such as ethane-1,2-dithiol and bis-(4-mercaptomethylphenyl) ether.

Examples of epoxide resins with groups of the formula II, in which R.sup.6 and R.sup.8 together are a -CH.sub.2 CH.sub.2 - group, are bis-(2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentyl glycidyl ether, 1,2-bis-(2,3-epoxycyclopentyloxy)-ethane and 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate.

Those epoxide resins are also suitable in which the 1,2-epoxide groups are bonded to heteroatoms of different type, for example the N,N,O-triglycidyl derivative of 4-aminophenol, the glycidyl ether/glycidyl ester of salicylic acid or p-hydroxybenzoic acid, N-glycidyl-N'-(2-glycidyloxypropyl)-5,5-dimethylhydantoin and 2-glycidyloxy-1,3-bis-(5,5-dimethyl-1-glycidyl-hydantoin-3-yl)-propane.

Novolak epoxide resins and polyoxyalkylene glycol polyglycidyl ethers are particularly preferred.

As the isocyanate resins (b) the reactive systems according to the invention preferably contain polyisocyanate compounds, in particular those containing aliphatic, cycloaliphatic or aromatic isocyanates or mixtures thereof.

Preferably, isomer mixtures of 4,4'- and 2,4'-diphenylmethane diisocyanate, polyol-modified polyisocyanates and mixtures of liquid polyisocyanates with higher-molecular polyisocyanates or carbodiimide-polyisocyanates are used.

Examples of further polyisocyanates which can be used are hexane 1,6-diisocyanate, cyclohexane 1,3-diisocyanate and isomers, 4,4'-dicyclohexylmethane diisocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-dimethylbenzene .omega.,.omega.'-diisocyanate and isomers, 1-methylbenzene 2,4-diisocyanate and isomers, naphthalene 1,4-diisocyanate, diphenyl ether 4,4'-diisocyanate and isomers, diphenyl sulfone 4,4'-diisocyanate and isomers, and also trifunctional or more highly functional isocyanates such as 3,3',4,4'-diphenylmethane tetraisocyanate. It is also possible to use isocyanates which are masked with phenol or cresol in the usual manner. Dimers and trimers of the polyvalent isocyanates mentioned can also be used. Such polyisocyanates have terminal free isocyanate groups and contain one or more uretdione and/or isocyanurate rings. Processes for preparing various types of such trimers and uretdiones are described, for example, in U.S. Pat. Nos. 3,494,888, 3,108,100 and 2,977,370.

In the reaction accelerators (c) according to the invention R.sup.1 can, if R.sup.1 is -(CH.sub.2).sub.n - with n=2-24, be for example ethylene, propylene, tetramethylene, octamethylene, decamethylene, heptadecylmethylene, eicosamethylene or tetracosamethylene.

Moreover, halogen-substituted phenylene or naphthylene R.sup.1 is monosubstituted or polysubstituted, in particular polysubstituted, phenylene or naphthylene, substitution being possible in any position. The halogen substituents are preferably chlorine and bromine.

Nitro-substituted phenylen or naphthylene R.sup.1 can be monosubstituted or polysubstituted, in particular monosubstituted, and substitution is possible in any position.

C.sub.1 -C.sub.4 Alkyl-substituted phenylene or naphthylene R.sup.1 can be monosubstituted or polysubstituted, preferably monosubstituted, and substitution is possible in any position. Examples of C.sub.1 -C.sub.4 alkyl substituents are methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl or tert-butyl.

C.sub.1 -C.sub.4 Alkoxy-substituted phenylene or naphthylene R.sup.1 can be monosubstituted or polysubstituted, in particular monosubstituted, and substitution is possible in any position. Examples of C.sub.1 -C.sub.4 alkoxy substituents are methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy or tert-butoxy.

In C.sub.3 -C.sub.8 dialkylaminoalkyl-substituted phenylene or naphthylene R.sup.1, C.sub.3 -C.sub.8 defines the total C number. It can be monosubstituted or disubstituted, in particular disubstituted. Examples of such substituents are dimethylaminoethyl, diethylaminobutyl or dimethylaminomethyl.

C.sub.1 -C.sub.12 Alkyl R.sup.2 and R.sup.3 are straight-chain or branched alkyl radicals, for example methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl or branched or straight-chain hexyl, octyl, nonyl or dodecyl. Halogen-substituted phenyl or naphthyl R.sup.2 and R.sup.3 are monosubstituted or polysubstituted, in particular polysubstituted, phenyl or naphthyl, substitution being possible in any position. The preferred halogen substituents are chlorine and bromine.

Nitro-substituted phenyl or naphthyl R.sup.2 and R.sup.3 can be monosubstituted or disubstituted, in particular disubstituted, substitution being possible in any position.

C.sub.1 -C.sub.4 Alkyl-substituted phenyl or naphthyl R.sup.2 and R.sup.3 can be monosubstituted or polysubstituted, preferably monosubstituted, substitution being possible in any position. Examples of possible alkyl substituents are methyl, ethyl, n-propyl or isobutyl. Examples are 2,4,6-trimethylphenyl, 2,5-dimethylphenyl, 3-isopropylphenyl, 4-methylphenyl, 3,4-diethylphenyl, 2-methylnaphthyl or 2,6-dimethylnaphthyl.

C.sub.1 -C.sub.4 Alkoxy-substituted phenyl or naphthyl R.sup.2 and R.sup.3 can be monosubstituted or poly-substituted, in particular monosubstituted, substitution being possible in any position. Examples of possible substituents are methoxy, ethoxy, n-propoxy, isopropoxy and n-butoxy.

Examples of phenyl or naphthyl radicals substituted in this way are 4-n-butoxyphenyl, 3,5-dimethoxyphenyl or 4-ethoxynaphthyl.

Examples of C.sub.7 -C.sub.13 aralkyl R.sup.2 and R.sup.3 are benzyl, 1- or 2-phenethyl, 3-phenylpropyl, .alpha.,.alpha.-dimethylbenzyl, 2-phenylisopropyl, 2-phenylhexyl or naphthylmethyl. Benzyl is preferred.

Examples of R.sup.2 and R.sup.3 forming, together with the N atom to which they are linked, a 5-membered, 6-membered or 7-membered heterocyclic ring are pyrrolidine, morpholine, piperazine, 4-methylpiperazine, piperidine or perhydroazepine radicals, but preferably morpholine, piperazine or piperidine radicals, especially the morpholine radical.

C.sub.1 -C.sub.8 Alkyl R.sup.4 and R.sup.5 are straight-chain or branched alkyl radicals, for example methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, straight-chain or branched pentyl, hexyl, heptyl or octyl.

However, straight-chain radicals R.sup.4 and R.sup.5 are preferred, especially methyl and ethyl.

Those compounds of the formula I are preferred in which R.sup.1 is -(CH.sub.2).sub.n - and n is a number from 2 to 20, especially 3 to 6.

Those compounds of the formula I are likewise of interest in which R.sup.2 and R.sup.3 independently of one another are C.sub.1 -C.sub.5 alkyl, especially methyl or ethyl.

Those compounds of formula I are of particular interest in which R.sup.2 and R.sup.3 are identical.

Those compounds of the formula I are especially preferred in which R.sup.1 is ethylene or propylene, and R.sup.2 and R.sup.3 are identical and are methyl, ethyl, propyl or butyl.

The EP/IC resins can also contain components which in general do not participate in the chemical reactions which lead to the hardened mouldings. Suitable fillers of this type are mineral and fibrous fillers, such as powdered silica, fused silica, alumina, glass powder, mica, kaolin, dolomite, graphite, carbon black as well as carbon fibres and textile fibres. Preferred fillers are powdered silica, fused silica, alumina or dolomite. Colorants, stabilizers and adhesion promoters as well as other additives of conventinal type can also be added to the EP/IC resins.

The reactive EP/IC resin systems, which can be hardened by the reaction accelerators of the formula I according to the invention, have preferably a molar mixing ratio of the epoxide and isocyanate groups (EP:IC) of 0.1 to 5.0 An EP:IC ratio of 0.3 to 2.5, but in particular a ratio of 0.4 to 1.0, is particularly preferred.

These reactive thermosetting EP/IC resin systems are used as unfilled or filled resins systems, especially as casting resins and impregnating resins for electrical engineering (for example, manufacture of pin-type insulators).

Casting resin processing in enclosed systems (pressure gelling process) is particularly preferred. In this case, the resin system is crosslinked under pressure at gelling temperatures from 130.degree. to 150.degree. C. and fully hardened at temperatures from 150.degree. to 250.degree. C.

Processing in a manner analogous to injection-moulding is also possible.

The reaction accelerators of the formula I are added to these EP/IC reactive resin systems for hardening, advantageously in quantities from 0.01-5.0% by weight, preferably 0.1 to 2.5% by weight, especially 0.1 to 1.5% by weight, relative to the unfilled casting resin composition.

The reaction accelerators of the formula I according to the invention can be prepared, for example, in the manner described in German Offenlegungsschrift 2,846,123.

Examples of reaction accelerators are listed in Table 1 which follows.

                                      TABLE 1
    __________________________________________________________________________
                              Boiling
                              point Viscosity
    Example
         Reaction accelerator [.degree.C.]
                                    in Pa.s
                                         n.sub.D.sup..alpha.
    __________________________________________________________________________
          ##STR6##            105-107/ 0.13 mbar
                                    140  1.4762
    2
          ##STR7##            147/ 1.3 mbar
    3
          ##STR8##            134.degree. C./ 0.52 mbar
                                    125  1.4801
    4
          ##STR9##            184/ 1.3 mbar
    __________________________________________________________________________

                  TABLE 2
    ______________________________________
    Time
    [minutes]
           0       5       10    20    30    34
    ______________________________________
    Viscosity
           15,000  15,500  16,000
                                 18,000
                                       18,500
                                             19,000
    [mPa.s]
    ______________________________________